Gold-Coated Silicon Substrates (Au/Ti on Si)
Au-Coated Si

Gold-Coated Silicon Substrates (Au/Ti on Si)

Price range: $29.00 through $179.00

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Gold-Coated Silicon Substrates (Au/Ti on Si (100))
Overview

Our gold-coated silicon substrates are fabricated using high-vacuum magnetron sputtering or thermal evaporation to ensure uniform thickness, strong adhesion, and clean surface morphology suitable for research and device fabrication.
A standard 10 nm titanium (Ti) adhesion layer is deposited between the silicon substrate and the gold layer to provide excellent film stability and long-term reliability.
This product is ideal for electrochemical research, microfabrication, MEMS development, RF structures, and sensor platforms.

Layer Structure
Standard structure:
Au (Gold layer)
Ti (10 nm adhesion layer)
Si (100) substrate

Adhesion Layer
Standard adhesion layer:
Ti (10 nm)
This configuration is widely used in research laboratories and microfabrication processes due to its excellent compatibility with Si/SiO2 and stable performance in electrochemical environments.
Custom adhesion thickness available upon request.

Gold Thickness Options
Standard Au thickness:
50 nm
100 nm
500 nm
Custom thickness available upon request.

Substrate Specifications
Standard configuration (default)
Orientation: Si (100)
Doping: N-type, 1–10 Ω·cm resistivity (phosphorus-doped)
Surface finish: Single-side polished (SSP)
This configuration is widely used in research laboratories, electrochemistry, and microfabrication.
Custom options available upon request
Doping: N-type or P-type
Surface finish: SSP or DSP
Custom resistivity range
Please contact us for special requirements or bulk orders.

Deposition Process
High-vacuum magnetron sputtering
Thermal evaporation (depending on thickness requirement)
Controlled deposition ensures uniform thickness and strong adhesion across the silicon surface.

Applications

Microelectrode fabrication
Electrochemical studies (HER, OER, CO2RR)
MEMS device development
RF and microwave structures
Bonding pads
Sensor and biosensor platforms
Micro-patterned gold devices
Quality & Packaging
Uniform film thickness control
Clean-room compatible handling
Protective packaging to prevent contamination
Research-grade surface quality

Why Choose Our Au on Si Substrates?

Research-grade quality
Optimized thickness selection
Competitive direct-manufacturer pricing
Custom Orders
We support:
Custom wafer diameter
Custom gold thickness
Patterned gold upon request
Contact us for technical consultation and academic pricing.

option

10 × 10 mm Si | 100 nm Au, 10 × 10 mm Si | 50 nm Au, 10 × 10 mm Si | 500 nm Au, 15 × 15 mm Si | 100 nm Au, 15 × 15 mm Si | 50 nm Au, 20 × 20 mm Si | 100 nm Au, 20 × 20 mm Si | 50 nm Au, 5 × 5 mm Si | 100 nm Au, 5 × 5 mm Si | 50 nm Au, 5 × 5 mm Si | 500 nm Au

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