High-Purity Copper Granules (Cu, 99.999%)
Application: Electron Transport Material for Perovskite Solar Cells, High-Purity Source for Thin Film Deposition
Product Overview: This high-purity copper material is supplied in granular form, offering stable physical and chemical properties suitable for advanced electrochemical and thin-film deposition applications, such as electron transport layers in perovskite devices.

Key Specifications:
Chemical Formula: Cu
Purity: 99.999%
Physical Form: Solid (Granules)
Granule Size: Dia. 3 mm x 3 mm (Diameter x Length)
CAS Number: 7440-50-8

Physical & Thermal Properties:
– Density: 8.96 g/cm^3
– Melting Point: 1084.62 deg C
– Boiling Point: 2562 deg C
– Heat of Fusion (Enthalpy): 13.26 kJ/mol
– Specific Heat: 24.860 J/(mol-K)
– Thermal Conductivity: 401 W/(m-K)
– Thermal Expansion Coefficient (25deg C): 16.5 um/(m-K)
– Crystal Structure: Face-centered cubic (FCC)

Electrical & Mechanical Properties (Representative Values):
– Electrical Resistivity (20deg C): 1.678 x 10^-8 Ohm-m
– Young’s Modulus: 110 – 128 GPa
– Shear Modulus: 48 GPa
– Bulk Modulus: 140 GPa
– Poisson’s Ratio: 0.34
– Brinell Hardness: 238 – 878 MPa
– Mohs Hardness: 3.0

Safety & Storage Notes:
– Keep away from fire and heat sources.
– Avoid direct contact with skin.
– Store separately from ammonia, concentrated hydrogen peroxide solutions, and strong acids.
Packaging Unit: 10 g/pack