Copper (Cu) Wire, 99.9999% Purity (Request Current Price)

Copper (Cu) Wire, 99.9999% Purity (Request Current Price)

ZHC LAB Copper (Cu) wire is a high-purity thin-film and materials-research source format supplied for PVD source loading, evaporation-related workflows, filament or wire studies, alloy preparation, and laboratory materials development. The wire and rod formats support precise cutting, weighing, fixture loading, and small-batch experimental work where material identity, purity, and clean handling are important. Pricing requires a current quote because high-purity wire and rod costs vary with purity, diameter, package size, and material market conditions.

Key Features

High-Purity Source Material
Available purity options include 99.9999% (6N) for research workflows that require controlled source composition.

Wire and Rod Form Factor
Available diameter and rod-size options include 0.118 in dia (3 mm) wire. Package options include 500 m, 1 kg depending on selected purity and size.

Clean Handling and Storage
Store sealed in a dry environment. Handle with clean gloves or tweezers and avoid contact with oils, dust, moisture, or other contaminants before use.

Technical Specifications

Material: Copper (Cu)
Form: Wire
Purity Options: 99.9999% (6N)
Available Size Options: 0.118 in dia (3 mm) wire
Package Options: 500 m, 1 kg
Category: Wires & Filaments
Typical Use: PVD source loading, wire evaporation research, filament-related studies, alloy preparation, and laboratory materials science

Quality-Control and Handling Indicators

Additional technical indicators reflected from the source product page:

– Analytical checks: ICP-MS trace-element analysis; ICP impurity/composition analysis; GDMS trace-metal analysis; carbon/sulfur impurity analysis; nitrogen/oxygen impurity analysis.
– Inspection focus: surface cleanliness measurement; micrometer dimensional inspection; appearance inspection; dimensional verification.
– Handling and storage: sealed dry storage and protective packaging; clean-glove handling to avoid oil, dust, moisture, and surface contamination; careful handling to prevent compression, impact, or chipping.

Common Applications

– ultra-high-purity copper source loading
– conductive thin-film and contact research
– high-purity metal reference and process development
– laboratory materials science workflows
– Academic, industrial, and pilot-scale materials research