Copper Nickel Silicon Silver Alloy (CuNiSiAg) Ingots, 99.99% Purity (Request Current Price)

Copper Nickel Silicon Silver Alloy (CuNiSiAg) Ingots, 99.99% Purity (Request Current Price)

ZHC LAB Copper Nickel Silicon Silver Alloy (CuNiSiAg) ingots are high-purity alloy source materials supplied for thin-film deposition research, evaporation source loading, custom alloy preparation, and laboratory materials development. The pellet and piece formats are convenient for weighing, loading, and small-batch experimental workflows where material identity, purity selection, and clean handling are important. Pricing requires a current quote because high-purity metal costs vary with purity, package size, and material market conditions.

Key Features

High-Purity Elemental Source Material
Available purity options include 99.99% (4N) for research workflows that require controlled metal composition.

Pellet and Piece Formats
Available particle or piece sizes include Custom specification, 0.984 in x 1.97 in x 1.57 in (25 x 50 x 40 mm) pieces. Package options include 1 kg depending on selected purity and size.

Clean Handling and Storage
Store sealed in a dry environment. Handle with clean gloves or tweezers and avoid contact with oils, dust, moisture, or other contaminants before use.

Technical Specifications

Material: Copper Nickel Silicon Silver Alloy (CuNiSiAg)
Form: Ingots
Purity Options: 99.99% (4N)
Available Size Options: Custom specification, 0.984 in x 1.97 in x 1.57 in (25 x 50 x 40 mm) pieces
Package Options: 1 kg
Category: Metal Pellets & Pieces
Typical Use: Evaporation source material, PVD research, alloy preparation, and laboratory materials science

Material Properties and Technical Indicators

Reference material-property values for selection, evaporation planning, and process evaluation:

– Formula / alloy system: CuNiSiAg
– Nominal composition: Cu:Ni:Si:Ag = 91.1:6:1.4:1.5 wt%

Quality-Control and Handling Indicators

Additional technical indicators reflected from the source product page:

– Analytical checks: ICP impurity/composition analysis.
– Inspection focus: dimensional verification.

Common Applications

– Cu-Ni-Si-Ag alloy source material research
– conductive copper alloy and contact material studies
– thin-film alloy process development
– laboratory materials synthesis
– Academic, industrial, and pilot-scale materials research