Tin (Sn) Pellets And Pieces, 99.99%-99.9999% Purity (Request Current Price)

Tin (Sn) Pellets And Pieces, 99.99%-99.9999% Purity (Request Current Price)

ZHC LAB Tin (Sn) pellets and pieces are high-purity source materials supplied for thin-film deposition research, evaporation source loading, alloy preparation, and laboratory materials development. The pellet and piece formats are convenient for weighing, loading, and small-batch experimental workflows where material identity, purity selection, and clean handling are important. Pricing requires a current quote because high-purity metal costs vary with purity, package size, and material market conditions.

Key Features

High-Purity Elemental Source Material
Available purity options include 99.999% (5N), 99.9999% (6N), 99.99% (4N) for research workflows that require controlled metal composition.

Pellet and Piece Formats
Available particle or piece sizes include 0.0394 in-0.236 in (1-6 mm) pieces, 0.0394 in-0.118 in (1-3 mm) pieces, 0.0787 in x 0.197 in dia/length (2 x 5 mm) cylindrical pellets. Package options include 1 kg, 100 g, 500 g depending on selected purity and size.

Clean Handling and Storage
Store sealed in a dry environment. Handle with clean gloves or tweezers and avoid contact with oils, dust, moisture, or other contaminants before use.

Technical Specifications

Material: Tin (Sn)
Form: Pellets And Pieces
Purity Options: 99.999% (5N), 99.9999% (6N), 99.99% (4N)
Available Size Options: 0.0394 in-0.236 in (1-6 mm) pieces, 0.0394 in-0.118 in (1-3 mm) pieces, 0.0787 in x 0.197 in dia/length (2 x 5 mm) cylindrical pellets
Package Options: 1 kg, 100 g, 500 g
Category: Metal Pellets & Pieces
Typical Use: Evaporation source material, PVD research, alloy preparation, and laboratory materials science

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: Sn
– CAS number: 7440-31-5
– Physical state: solid
– Melting point: 231.93 °C
– Boiling point: 2602 °C
– Thermal expansion coefficient: (25 °C)22.0 m·m-1·K-1
– Thermal conductivity: 66.8 W·m-1·K-1
– Electrical resistivity: (0 °C)115 nΩ·m
– Young’s modulus: 50 GPa
– Shear modulus: 18 GPa
– Bulk modulus: 58 GPa
– Mohs hardness: 1.5
– Poisson’s ratio: 0.36
– Brinell hardness: 350MPa

Quality-Control and Handling Indicators

Additional technical indicators reflected from the source product page:

– Analytical checks: ICP-MS trace-element analysis; ICP impurity/composition analysis; GDMS trace-metal analysis; carbon/sulfur impurity analysis; nitrogen/oxygen impurity analysis.
– Inspection focus: surface cleanliness measurement; micrometer dimensional inspection; appearance inspection; dimensional verification.
– Handling and storage: sealed dry storage and protective packaging; clean-glove handling to avoid oil, dust, moisture, and surface contamination; careful handling to prevent compression, impact, or chipping.
– Deposition-use context: magnetron sputtering systems; ion sputtering systems; micro/nano fabrication research; semiconductor thin-film development; photovoltaic materials research; flat-panel display coating research.

Common Applications

– tin source loading for evaporation workflows
– metal film deposition research
– solder, alloy, and low-melting-point metal studies
– laboratory materials development
– Academic, industrial, and pilot-scale materials research