Silver (Ag) Sputtering Target, 99.99% Purity, SEM Consumable Format, Circular (Price Upon Request)

Silver (Ag) Sputtering Target, 99.99% Purity, SEM Consumable Format, Circular (Price Upon Request)

ZHC LAB’s Silver (Ag) sputtering target is a 99.99% purity, sem consumable format noble-metal conductive PVD source material for magnetron sputtering, ion sputtering, and laboratory thin-film deposition. It is supplied in circular target formats for research, development, and small-batch process work where clean handling, dimensional consistency, and reliable material identity are important. Pricing is provided upon request because final cost depends on selected dimensions and current material market conditions.

Key Features

Research-Grade Source Material
Supplied as 99.99% Purity, SEM Consumable Format for thin-film workflows that require controlled source composition and dependable deposition behavior.

Circular Target Formats
Available in circular diameters including 2.28 inch diameter (58 mm), 2.24 inch diameter (57 mm), 2.13 inch diameter (54 mm). Thickness and mounting options include 0.2 mm thick, 0.5 mm thick, 0.1 mm thick, 0.3 mm thick, depending on selected configuration.

Controlled Processing and Inspection
Target preparation may include material selection, forming, heat treatment, precision machining, dimensional inspection, surface finishing, cleaning, and final quality review. Composition and impurity control may be supported by analytical methods such as ICP, GDMS, carbon/sulfur analysis, oxygen/nitrogen analysis, and metallographic inspection where appropriate.

Clean Handling and Packaging
Targets are prepared for deposition use with clean surface handling and protective packaging. Store sealed in a dry environment, handle with clean gloves, and avoid direct contact with oil, dust, moisture, or other surface contamination before installation.

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: Ag
– CAS number: 7740-22-4
– Density: 10.49 g·cm^)3
– Physical state: solid
– Melting point: 961.78 °C
– Boiling point: 2162 °C
– Heat of fusion: 11.28 kJ·mol^)1
– Specific heat capacity: 25.31 J·mol^)1·K^)1
– Crystal structure: face-centered cubic
– Magnetic order: diamagnetic
– Thermal expansion coefficient: (25 °C)18.9 m·m^)1·K^)1
– Thermal conductivity: 429 W·m^)1·K^)1
– Electrical resistivity: (20 °C)15.87n Ω·m
– Young’s modulus: 83 MPa
– Shear modulus: 30 GPa
– Bulk modulus: 100 GPa
– Mohs hardness: 2.5
– Poisson’s ratio: 0.37

Common Applications

– SEM sample coating; conductive noble-metal coating research; electron microscopy preparation workflows; small-format sputter coater use
– Academic, industrial, and pilot-scale thin-film process development