Copper (Cu) Pellets, Evaporation Grade, Cylindrical

Copper (Cu) Pellets, Evaporation Grade, Cylindrical

ZHC LAB’s Copper (Cu) Pellets are high-purity cylindrical evaporation source material for thermal and electron-beam (e-beam) physical vapor deposition (PVD) of copper thin films. Each pellet is precision-cut to uniform dimensions for consistent loading and controlled evaporation behavior in standard thermal boats, crucible liners, and e-beam pocket hearths. Copper thin films deposited from these pellets exhibit high electrical and thermal conductivity, excellent electromigration resistance, and strong adhesion to common substrates with appropriate adhesion layers. Sold by net weight; each package contains multiple pellets. Available in 99.99% (4N) and 99.999% (5N) purity grades, with multiple pellet dimensions and package weights to suit different deposition system capacities and throughput requirements. Each lot ships with a Certificate of Analysis (COA) documenting purity and trace element composition. Custom pellet dimensions, higher purities (up to 99.9999%), spherical forms, and irregular pieces are available upon request.

MATERIAL SPECIFICATIONS:
Material: copper (Cu)
CAS number: 7440-50-8
Purity options: 99.99% (4N), 99.999% (5N)
Pellet shape: cylindrical
Available sizes: φ3 mm × 3 mm (1/8 inch dia × 1/8 inch length); φ6 mm × 6 mm (1/4 inch dia × 1/4 inch length)
Package sizes: 50 g, 100 g (multiple pellets per package)
Appearance: metallic reddish-pink cylindrical pellets
Melting point: 1,085 °C (1,985 °F)
Density: 8.96 g/cm3
Deposition method: thermal evaporation, e-beam evaporation
Quality documentation: Certificate of Analysis (COA) included

COMMON APPLICATIONS: Thermal and e-beam evaporation of copper thin films for semiconductor interconnect seed layers and metallization; electrode fabrication in MEMS, sensors, and microelectronic devices; conductive layer deposition in solar cell and photovoltaic research; copper seed layers for subsequent electroplating processes; optical and decorative coatings; alloy preparation and materials research; research-grade thin film studies in materials science, physics, and electrical engineering laboratories.

USAGE NOTES: Load pellets into a clean tungsten boat, molybdenum boat, or e-beam crucible liner. For thermal evaporation, ramp source temperature gradually; copper wets tungsten and molybdenum boats well at evaporation temperature. For e-beam evaporation, use a graphite or ceramic crucible liner to prevent copper alloying with the copper hearth. Recommended base pressure before deposition: ≤5 × 106 Torr. Use high-purity argon or nitrogen backfill if reactive deposition is not desired. Store pellets in the original sealed container in a clean, dry environment. Copper may develop a thin surface oxide during storage; this does not affect evaporation performance, as the oxide dissociates at deposition temperature. For applications requiring zero oxide content, store under inert atmosphere.
Copper (Cu) Pellets, Evaporation Grade, Cylindrical

ZHC LAB’s Copper (Cu) Pellets are high-purity cylindrical evaporation source material for thermal and electron-beam (e-beam) physical vapor deposition (PVD) of copper thin films. Each pellet is precision-cut to uniform dimensions for consistent loading and controlled evaporation behavior in standard thermal boats, crucible liners, and e-beam pocket hearths. Copper thin films deposited from these pellets exhibit high electrical and thermal conductivity, excellent electromigration resistance, and strong adhesion to common substrates with appropriate adhesion layers. Sold by net weight; each package contains multiple pellets. Available in 99.99% (4N) and 99.999% (5N) purity grades, with multiple pellet dimensions and package weights to suit different deposition system capacities and throughput requirements. Each lot ships with a Certificate of Analysis (COA) documenting purity and trace element composition. Custom pellet dimensions, higher purities (up to 99.9999%), spherical forms, and irregular pieces are available upon request.

MATERIAL SPECIFICATIONS:
Material: copper (Cu)
CAS number: 7440-50-8
Purity options: 99.99% (4N), 99.999% (5N)
Pellet shape: cylindrical
Available sizes: φ3 mm × 3 mm (1/8 inch dia × 1/8 inch length); φ6 mm × 6 mm (1/4 inch dia × 1/4 inch length)
Package sizes: 50 g, 100 g (multiple pellets per package)
Appearance: metallic reddish-pink cylindrical pellets
Melting point: 1,085 °C (1,985 °F)
Density: 8.96 g/cm3
Deposition method: thermal evaporation, e-beam evaporation
Quality documentation: Certificate of Analysis (COA) included

COMMON APPLICATIONS: Thermal and e-beam evaporation of copper thin films for semiconductor interconnect seed layers and metallization; electrode fabrication in MEMS, sensors, and microelectronic devices; conductive layer deposition in solar cell and photovoltaic research; copper seed layers for subsequent electroplating processes; optical and decorative coatings; alloy preparation and materials research; research-grade thin film studies in materials science, physics, and electrical engineering laboratories.

USAGE NOTES: Load pellets into a clean tungsten boat, molybdenum boat, or e-beam crucible liner. For thermal evaporation, ramp source temperature gradually; copper wets tungsten and molybdenum boats well at evaporation temperature. For e-beam evaporation, use a graphite or ceramic crucible liner to prevent copper alloying with the copper hearth. Recommended base pressure before deposition: ≤5 × 106 Torr. Use high-purity argon or nitrogen backfill if reactive deposition is not desired. Store pellets in the original sealed container in a clean, dry environment. Copper may develop a thin surface oxide during storage; this does not affect evaporation performance, as the oxide dissociates at deposition temperature. For applications requiring zero oxide content, store under inert atmosphere.
Copper (Cu) Pellets, Evaporation Grade, Cylindrical

ZHC LAB’s Copper (Cu) Pellets are high-purity cylindrical evaporation source material for thermal and electron-beam (e-beam) physical vapor deposition (PVD) of copper thin films. Each pellet is precision-cut to uniform dimensions for consistent loading and controlled evaporation behavior in standard thermal boats, crucible liners, and e-beam pocket hearths. Copper thin films deposited from these pellets exhibit high electrical and thermal conductivity, excellent electromigration resistance, and strong adhesion to common substrates with appropriate adhesion layers. Sold by net weight; each package contains multiple pellets. Available in 99.99% (4N) and 99.999% (5N) purity grades, with multiple pellet dimensions and package weights to suit different deposition system capacities and throughput requirements. Each lot ships with a Certificate of Analysis (COA) documenting purity and trace element composition. Custom pellet dimensions, higher purities (up to 99.9999%), spherical forms, and irregular pieces are available upon request.

MATERIAL SPECIFICATIONS:
Material: copper (Cu)
CAS number: 7440-50-8
Purity options: 99.99% (4N), 99.999% (5N)
Pellet shape: cylindrical
Available sizes: φ3 mm × 3 mm (1/8 inch dia × 1/8 inch length); φ6 mm × 6 mm (1/4 inch dia × 1/4 inch length)
Package sizes: 50 g, 100 g (multiple pellets per package)
Appearance: metallic reddish-pink cylindrical pellets
Melting point: 1,085 °C (1,985 °F)
Density: 8.96 g/cm3
Deposition method: thermal evaporation, e-beam evaporation
Quality documentation: Certificate of Analysis (COA) included

COMMON APPLICATIONS: Thermal and e-beam evaporation of copper thin films for semiconductor interconnect seed layers and metallization; electrode fabrication in MEMS, sensors, and microelectronic devices; conductive layer deposition in solar cell and photovoltaic research; copper seed layers for subsequent electroplating processes; optical and decorative coatings; alloy preparation and materials research; research-grade thin film studies in materials science, physics, and electrical engineering laboratories.

USAGE NOTES: Load pellets into a clean tungsten boat, molybdenum boat, or e-beam crucible liner. For thermal evaporation, ramp source temperature gradually; copper wets tungsten and molybdenum boats well at evaporation temperature. For e-beam evaporation, use a graphite or ceramic crucible liner to prevent copper alloying with the copper hearth. Recommended base pressure before deposition: ≤5 × 106 Torr. Use high-purity argon or nitrogen backfill if reactive deposition is not desired. Store pellets in the original sealed container in a clean, dry environment. Copper may develop a thin surface oxide during storage; this does not affect evaporation performance, as the oxide dissociates at deposition temperature. For applications requiring zero oxide content, store under inert atmosphere.