Gold (Au) Bonding Wire, 99.99% Purity (Request Current Price)

Gold (Au) Bonding Wire, 99.99% Purity (Request Current Price)

ZHC LAB Gold (Au) bonding wire is a high-purity thin-film and materials-research source format supplied for PVD source loading, evaporation-related workflows, filament or wire studies, alloy preparation, and laboratory materials development. The wire and rod formats support precise cutting, weighing, fixture loading, and small-batch experimental work where material identity, purity, and clean handling are important. Pricing requires a current quote because high-purity wire and rod costs vary with purity, diameter, package size, and material market conditions.

Key Features

High-Purity Source Material
Available purity options include 99.99% (4N) for research workflows that require controlled source composition.

Wire and Rod Form Factor
Available diameter and rod-size options include 0.000984 in dia (0.025 mm) wire, 0.0015 in dia (0.038 mm) wire, 0.000512 in dia (0.013 mm) wire, 0.000591 in dia (0.015 mm) wire, 0.00118 in dia (0.03 mm) wire, 0.00138 in dia (0.035 mm) wire, 0.000709 in dia (0.018 mm) wire, 0.000906 in dia (0.023 mm) wire, 0.000551 in dia (0.014 mm) wire, 0.00063 in dia (0.016 mm) wire, 0.000669 in dia (0.017 mm) wire, 0.000748 in dia (0.019 mm) wire, 0.000787 in dia (0.02 mm) wire, 0.000827 in dia (0.021 mm) wire, 0.000866 in dia (0.022 mm) wire, 0.000945 in dia (0.024 mm) wire, 0.00126 in dia (0.032 mm) wire, 0.00197 in dia (0.05 mm) wire. Package options include 100 m, 500 m, 300 m depending on selected purity and size.

Clean Handling and Storage
Store sealed in a dry environment. Handle with clean gloves or tweezers and avoid contact with oils, dust, moisture, or other contaminants before use.

Technical Specifications

Material: Gold (Au)
Form: Bonding Wire
Purity Options: 99.99% (4N)
Available Size Options: 0.000984 in dia (0.025 mm) wire, 0.0015 in dia (0.038 mm) wire, 0.000512 in dia (0.013 mm) wire, 0.000591 in dia (0.015 mm) wire, 0.00118 in dia (0.03 mm) wire, 0.00138 in dia (0.035 mm) wire, 0.000709 in dia (0.018 mm) wire, 0.000906 in dia (0.023 mm) wire, 0.000551 in dia (0.014 mm) wire, 0.00063 in dia (0.016 mm) wire, 0.000669 in dia (0.017 mm) wire, 0.000748 in dia (0.019 mm) wire, 0.000787 in dia (0.02 mm) wire, 0.000827 in dia (0.021 mm) wire, 0.000866 in dia (0.022 mm) wire, 0.000945 in dia (0.024 mm) wire, 0.00126 in dia (0.032 mm) wire, 0.00197 in dia (0.05 mm) wire
Package Options: 100 m, 500 m, 300 m
Category: Wires & Filaments
Typical Use: PVD source loading, wire evaporation research, filament-related studies, alloy preparation, and laboratory materials science

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: Au
– CAS number: 7440-57-5
– Density: 19.30 g·cm-3
– Physical state: solid
– Melting point: 1064.18°C
– Boiling point: 2856°C
– Heat of fusion: 12.55 kJ·mol-1
– Specific heat capacity: 25.418 J·mol-1·K-1
– Crystal structure: face-centered cubic
– Magnetic order: diamagnetic
– Thermal expansion coefficient: (25 °C)14.2 m·m-1·K-1
– Thermal conductivity: 318 W·m-1·K-1
– Electrical resistivity: (20 °C)22.14 n Ω·m
– Young’s modulus: 79 MPa
– Shear modulus: 27 GPa
– Bulk modulus: 180 GPa
– Poisson’s ratio: 0.44
– Vickers hardness: 216 MPa
– Mohs hardness: 2.5

Quality-Control and Handling Indicators

Additional technical indicators reflected from the source product page:

– Analytical checks: ICP-MS trace-element analysis; ICP impurity/composition analysis; GDMS trace-metal analysis; carbon/sulfur impurity analysis; nitrogen/oxygen impurity analysis.
– Inspection focus: surface cleanliness measurement; micrometer dimensional inspection; appearance inspection; dimensional verification.
– Handling and storage: sealed dry storage and protective packaging; clean-glove handling to avoid oil, dust, moisture, and surface contamination; careful handling to prevent compression, impact, or chipping.

Common Applications

– gold bonding wire research and microelectronics materials development
– noble-metal wire handling and process evaluation
– high-purity contact and interconnect studies
– laboratory thin-film and device-material workflows
– Academic, industrial, and pilot-scale materials research