Nickel (Ni) Sputtering Target, 99.995% (4N5) Purity, Circular

Nickel (Ni) Sputtering Target, 99.995% (4N5) Purity, Circular (Price Upon Request)

ZHC LAB’s Nickel (Ni) Sputtering Target is a high-purity circular PVD source material designed for magnetron sputtering, ion sputtering, and related thin-film deposition systems. With 99.995% (4N5) nickel purity and multiple standard diameters and thicknesses, this target supports research, pilot-scale process development, semiconductor device fabrication, photovoltaic materials, flat-panel display coatings, and specialty functional films.

Key Features

High-Purity Nickel Source Material
Manufactured from high-quality nickel feedstock and supplied at 99.995% (4N5) purity for thin-film research and deposition workflows requiring controlled metallic impurity levels.

Circular Target Formats
Available in common circular target diameters including 1 inch, 2 inch, 3 inch, and 4 inch formats, plus metric diameters such as 50 mm, 60 mm, 80 mm, and 100 mm. Multiple thickness options support compatibility with a wide range of sputtering cathodes and target holders.

Controlled Processing and Inspection
Target manufacturing may include melting/casting, forming, heat treatment, machining, dimensional inspection, surface cleaning, and final inspection. Composition control is supported by analytical methods such as ICP, GDMS, carbon/sulfur analysis, and nitrogen/oxygen analysis, while metallographic inspection helps evaluate internal structure and material uniformity.

Clean Handling and Packaging
Targets are prepared for laboratory and deposition use with clean surface handling, protective vacuum-bag packaging, and rigid outer packaging for transit. Handle with clean gloves and avoid direct skin contact, oil, dust, or other surface contamination before mounting.

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: Ni
– CAS number: 7440-02-0
– Density: 8.908 g·cm-3
– Physical state: solid
– Melting point: 1455 °C
– Boiling point: 2913 °C
– Heat of fusion: 17.48 kJ·mol-1
– Heat of vaporization: 377.5 kJ·mol-1
– Specific heat capacity: 26.07 J·mol-1·K-1
– Liquid density at melting point: 7.81 g·cm-3
– Crystal structure: face-centered cubic
– Magnetic order: ferromagnetic
– Thermal expansion coefficient: (25 °C)13.4 m·m-1·K-1
– Thermal conductivity: 90.9W·m-1·K-1
– Electrical resistivity: (20 °C)69.3 uΩ·m
– Young’s modulus: 200 GPa
– Shear modulus: 76 GPa
– Bulk modulus: 180 GPa
– Brinell hardness: 700 MPa
– Mohs hardness: 4.0
– Poisson’s ratio: 0.31

Common Applications

– Nickel thin-film deposition by PVD and magnetron sputtering
– Semiconductor and micro/nanofabrication research
– Device fabrication and electrode film development
– Solar photovoltaic material research
– Flat-panel display and functional coating development
– Specialty metallic coating studies
– Academic, industrial, and pilot-scale thin-film process development